| PART |
Description |
Maker |
| UPC2747TB-E3 UPC2748TB |
3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS
3 V/ SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS
|
NEC Corp.
|
| UPC2747TB UPC2747TB-E3 UPC2748TB UPC2748TB-E3 |
3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS
|
NEC[NEC]
|
| W83977TF |
W83877TF plus KBC, GP I/O, Wake-Up
|
Winbond Electronics
|
| UPC2771TB UPC2763TB-E3 UPC2771TB-E3 |
3 V/ SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS 3伏，超级MINIMOLD硅MMIC中功率放大器输出功率移动通信
3 V/ 2.9 GHz SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC, Corp.
|
| UPC2762TB1 |
3 V, SUPER MINIMOLD SILICON MMIC MEDIUM OUTPUT POWER AMPLIFIER FOR MOBILE COMMUNICATIONS
|
NEC
|
| F7185809 |
Hardware KBC with ACPI, Temp. and Fan Control
|
Feature Integration Technology Inc.
|
| HYB18M1G320BF-7.5 |
DRAMs for Mobile Applications 1-Gbit x32 DDR Mobile-RAM
|
Qimonda AG
|
| HYB18L128160BC-7.5 HYE18L128160BC-7.5 HYB18L128160 |
DRAMs for Mobile Applications 128-Mbit Mobile-RAM
|
Qimonda AG
|
| 9UMS9633 ICS9UMS9633B 9UMS9633BKLFT |
ULTRA MOBILE PC/MOBILE INTERNET DEVICE
|
Integrated Device Technology
|
| 82845MP 82845MZ 82845MX |
Intel 845 Family Chipset-Mobile 82845MP/82845MZ Chipset Memory Controller Hub Mobile (MCH-M)
|
Intel Corp.
|
| HYB18M1G320BF HYE18M1G320BF-7.5 HYB18M1G320BF-7.5 |
DRAMs for Mobile Applications 1-Gbit x32 DDR Mobile-RAM 8M X 32 DDR DRAM, 6.5 ns, PBGA90
|
Qimonda AG
http://
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